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GENNEL G109 10gram Thermal Conductive Glue, Silicone Glue, Thermal Plaster, Silicone Viscous Adhesive Compound, Heatsink Glue for LED GPU MOSFET Printer Chipset IC High Performance sold2025 scottchen PRO Spindle Sander AdaptorGENNEL G109 10gram Thermal Conductive Glue, Silicone Glue, Thermal Plaster, Silicone Viscous Adhesive Compound, Heatsink Glue for LED GPU MOSFET Printer Chipset IC High Performance Melting capacity 0 (250 24Hours) Evaporation 0. 001% (250 24Hours) Full Cure Time 24 Hours Thermal conductivity > 1. 2W m K Thermal Impedance <0. 06 Adhesion and tensile strength 2. 1 (MPa) Insulation coefficient > 5. 1 Dissipation coefficient <0. 005 Temperature resistance