SKU: 96899094482
Ships within 48 hours · Estimated delivery Aug 24 - Aug 29
1) Use Sony IMX317 Sensor
the lead-free soldering iron tip has fast heat conduction
Extremely low noise and space saving design
Multiple combination modules
screen will not fall off even if damaged
LUOWEI HS3 Preheating Platform Phone PCB Layering IC Glue Remover Oscilloscope 1) Use Sony IMX317 SensorLuowei HS3 Uniform Preheat Platform Phone Motherboard CPU IC Heating Plate for mobile phone PCB board layering laminating chip glue removal, etc. Luowei HS3 99W constant temperature control preheating platform 65mm*100mm heating size suitable for various mobile phone motherboards tinning, degumming, and laminating, etc. Features: 1. Material construction: Made of aviation aluminum alloy, it not only improves durability but also ensures efficient
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